Details
BUY IRF7210 https://www.utsource.net/itm/p/6832306.html
Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
---|---|---|---|---|---|---|
Drain-Source Voltage | VDS | - | - | 20 | V | |
Gate-Source Voltage | VGS | -10 | - | 10 | V | |
Continuous Drain Current | ID | - | 7 | - | A | TC = 25°C, Rth(j-a) = 62.5°C/W |
Pulse Drain Current | IDM | - | 34 | - | A | tp = 10 μs, IGBT = off |
Total Power Dissipation | PD | - | 18 | - | W | TC = 25°C |
Junction Temperature | Tj | -55 | - | 175 | °C | |
Storage Temperature | Tstg | -55 | - | 150 | °C | |
Thermal Resistance, Junction to Ambient | RθJA | - | 62.5 | - | °C/W |
Instructions for Use:
Handling and Storage:
- Store in a cool, dry place away from direct sunlight.
- Handle with care to avoid damage to the leads and body.
Mounting:
- Ensure proper heat sinking if operating near maximum power dissipation.
- Follow manufacturer guidelines for PCB layout to minimize parasitic inductance.
Electrical Connections:
- Connect gate to control circuitry using short leads to minimize noise.
- Ensure source is properly grounded to prevent floating potentials.
Operating Limits:
- Do not exceed the maximum ratings listed in the table.
- Operate within specified temperature ranges to ensure reliability.
Testing:
- Test devices under controlled conditions before incorporating into final designs.
- Use appropriate safety measures when testing high voltage or current circuits.
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