Details

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BUY IRLML6302TRPBF https://www.utsource.net/itm/p/6938796.html

Parameter	Symbol	Min	Typ	Max	Unit	Conditions
Drain-Source On-Resistance	RDS(on)	-	0.017	-	Ω	VGS = 4.5V, ID = 2A
Gate Threshold Voltage	VGS(th)	0.8	-	2.0	V	ID = 250μA
Continuous Drain Current	ID	-	-	3.9	A	TC = 25°C
Power Dissipation	PD	-	-	0.67	W	TC = 25°C
Junction Temperature	TJ	-	-	150	°C
Storage Temperature Range	TSTG	-55	-	150	°C

Instructions for IRLML6302TRPBF

1. Handling Precautions: This device is sensitive to electrostatic discharge (ESD). Use proper ESD protection equipment and procedures when handling the component.

2. Mounting: Ensure that the mounting process does not exceed the maximum ratings specified in the table. Avoid excessive heat during soldering to prevent damage to the device.

3. Operating Conditions: Operate within the specified temperature range to ensure reliable performance. The junction temperature should not exceed 150°C.

4. Testing: When testing the device, apply voltages and currents within the limits specified to avoid damaging the component.

5. Storage: Store the device in a dry, cool place within the storage temperature range specified.

6. Application Considerations: For optimal performance, consider using heatsinks or other cooling methods if operating near the maximum power dissipation.

7. Soldering: Follow standard surface mount technology (SMT) soldering guidelines. Ensure that the soldering temperature does not exceed the maximum junction temperature.

8. Circuit Design: Design circuits with appropriate decoupling capacitors to minimize noise and improve stability.

(For reference only)