Details
BUY NH82801FBM SL89K https://www.utsource.net/itm/p/6942640.html
| Parameter | Description |
|---|---|
| Part Number | NH82801FBM SL89K |
| Manufacturer | Intel |
| Package Type | BGA (Ball Grid Array) |
| I/O Count | 476 |
| Core Voltage | 1.5V |
| Operating Temperature | -40°C to +85°C |
| Data Sheet | Refer to manufacturer's official data sheet for detailed specifications |
Instructions:
- Power Supply Requirements: Ensure that the core voltage is supplied within the specified range of 1.5V. Use appropriate voltage regulators and decoupling capacitors as close to the power pins as possible.
- Installation: Handle the BGA package with care to avoid damage to the balls. Follow recommended soldering profiles for BGA components to ensure reliable connections.
- Thermal Management: Implement adequate cooling solutions if operating in environments near the upper temperature limit. Consider thermal vias and heat sinks as necessary.
- Signal Integrity: Pay special attention to signal integrity, especially for high-speed signals. Use controlled impedance routing and proper termination techniques.
- Refer to Data Sheet: For detailed information on pin configurations, timing diagrams, and other specific parameters, refer to the official data sheet provided by Intel.
For more detailed instructions and specifications, consult the official Intel documentation or data sheet for the NH82801FBM SL89K.
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