Details

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BUY M2303ADN https://www.utsource.net/itm/p/7044194.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VDD	Operating	1.65	-	5.5	V
Output Current	IOUT	High Level	-	8	20	mA
Input Leakage Current	IIH	VIN = VDD	-	1	10	uA
Input Capacitance	CIN		-	5	-	pF
Output Low Voltage	VOL	IOL = 8mA	0.4	-	0.9	V
Output High Voltage	VOH	IOH = -8mA	2.4	-	VDD-0.9	V
Propagation Delay	tPD	VDD=5V, RL=50Ω	7	-	15	ns
Power Dissipation	PD		-	100	-	mW

Instructions for M2303ADN

1. Supply Voltage (VDD):

   • Ensure the supply voltage is within the range of 1.65V to 5.5V for reliable operation.

2. Output Current (IOUT):

   • The device can source up to 20mA at its output pin when operating under high-level conditions.

3. Input Leakage Current (IIH):

   • Keep in mind that input leakage current should be as low as possible; it typically ranges from 1uA to 10uA at VIN = VDD.

4. Input Capacitance (CIN):

   • The typical input capacitance is 5pF, which affects signal transmission speed and should be considered in circuit design.

5. Output Voltage Levels:

   • When sourcing current (IOH = -8mA), the output high voltage should be at least VDD - 0.9V.
   • When sinking current (IOL = 8mA), the output low voltage should not exceed 0.9V.

6. Propagation Delay (tPD):

   • For a VDD of 5V with a load resistance of 50Ω, ensure the propagation delay does not exceed 15ns.

7. Power Dissipation (PD):

   • The power dissipation should be kept below 100mW to avoid overheating and potential damage to the device.

8. Handling and Storage:

   • Handle the device carefully to avoid electrostatic discharge (ESD) damage. Store in anti-static packaging when not in use.

9. Mounting:

   • Follow standard surface-mount technology (SMT) procedures for mounting on PCBs. Ensure proper thermal management if high power dissipation is expected.

For detailed specifications and application notes, refer to the manufacturer's datasheet or technical documentation.

(For reference only)