Details
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Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Supply Voltage | VDD | Operating | 2.7 | - | 5.5 | V |
Operating Temperature | Ta | Continuous | -40 | - | 85 | °C |
Output Current | IOUT | Per Channel | - | 100 | 200 | mA |
Standby Current | ISB | VDD = 5V | - | 1 | 5 | μA |
High-Level Input Voltage | VIH | 2.0 | - | VDD | V | |
Low-Level Input Voltage | VIL | 0 | - | 0.8 | V | |
Propagation Delay Time | tpd | Rising/Falling | - | 100 | 200 | ns |
Instructions for RA80H1415M1
Power Supply Requirements:
- Ensure the supply voltage (VDD) is within the range of 2.7V to 5.5V.
- Use appropriate decoupling capacitors close to the power pins to minimize noise and transients.
Operating Environment:
- The device can operate in temperatures ranging from -40°C to +85°C. Ensure adequate heat dissipation if operating near the upper temperature limit.
Output Current Handling:
- Each channel can provide up to 200mA output current. Do not exceed this limit to avoid damaging the device.
- For applications requiring higher currents, consider external current boosting circuits.
Standby Mode:
- In standby mode, the device consumes between 1μA and 5μA at a supply voltage of 5V. This helps in reducing power consumption during idle states.
Input Voltage Levels:
- Recognize high-level input voltages (VIH) as any value from 2.0V to VDD.
- Recognize low-level input voltages (VIL) as any value from 0V to 0.8V.
Propagation Delay:
- Expect a propagation delay time (tpd) of approximately 100ns to 200ns for signal transitions.
Handling and Storage:
- Handle with care to avoid electrostatic discharge (ESD). Store in an ESD-protected environment when not in use.
Mounting and PCB Design:
- Follow standard guidelines for surface-mount technology (SMT) components. Ensure proper clearance and thermal considerations are met on the PCB layout.
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