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BUY 74LVC1G11DW-7 https://www.utsource.net/itm/p/7281665.html
74LVC1G Family, Diodes Inc Low-Voltage CMOS logic Single gate package Operating Voltage: 1.65 to 5.5 V Compatibility: Input LVTTL/TTL, Output LVCMOS
Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
---|---|---|---|---|---|---|
Supply Voltage | VCC | Operating | 1.65 | 5.5 | V | |
Input Low Voltage | VIL | 0 | 0.8 | V | ||
Input High Voltage | VIH | 2.0 | VCC | V | ||
Output Low Voltage | VOL | IOH = -4mA | 0 | 0.1 | V | |
Output High Voltage | VOH | IOL = 4mA | VCC-0.1 | VCC | V | |
Propagation Delay Time | tpd | VCC=3.3V, TA=25°C | 4.2 | ns | ||
Power Dissipation | PD | Continuous | 190 | mW | ||
Operating Temperature | TOPR | Storage | -55 | 125 | °C |
Instructions for 74LVC1G11DW-7
Supply Voltage: Ensure the supply voltage (VCC) is within the range of 1.65V to 5.5V to avoid damaging the device or causing erratic behavior.
Input Voltages:
- For a low logic level, ensure input voltages (VIL) do not exceed 0.8V.
- For a high logic level, input voltages (VIH) should be at least 2.0V and can go up to the supply voltage (VCC).
Output Voltages:
- When sinking current (IOL = 4mA), the output voltage (VOL) should not exceed 0.1V.
- When sourcing current (IOH = -4mA), the output voltage (VOH) should be at least VCC - 0.1V.
Propagation Delay: At an operating temperature of 25°C and a supply voltage of 3.3V, the propagation delay time (tpd) is typically 4.2ns. Adjust expectations if operating conditions differ.
Power Dissipation: The maximum power dissipation (PD) is 190mW. Ensure adequate heat dissipation if operating near this limit.
Operating Temperature: The device is designed to operate between -55°C and 125°C. Ensure environmental conditions do not exceed these limits.
Handling Precautions: Handle with care to prevent electrostatic discharge (ESD) damage. Use proper ESD protection measures during handling and installation.
Mounting and Connections: Ensure all connections are secure and correctly oriented. Follow standard surface mount technology (SMT) procedures for mounting on PCBs.
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