Details

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BUY NCP4304ADR2G https://www.utsource.net/itm/p/7285715.html
MOSFET & IGBT Drivers, ON Semiconductor Power drivers for MOSFET and IGBT in low side, high side, and half-bridge circuits.

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Input Voltage	VIN	Operating	2.7	-	5.5	V
Output Voltage	VOUT	Fixed Output	-	3.3	-	V
Quiescent Current	IQ	VIN = 5V	-	40	-	μA
Dropout Voltage	VD	ILOAD = 100mA	-	250	-	mV
Load Regulation		ILOAD: 0 to 300mA	-	0.5	-	%
Line Regulation		VIN: 2.7 to 5.5V	-	0.1	-	%
Power Supply Rejection Ratio	PSRR	f = 1kHz	-	65	-	dB

Instructions for Use:

1. Input Voltage (VIN):

   • Ensure the input voltage is within the operating range of 2.7V to 5.5V.

2. Output Voltage (VOUT):

   • The device provides a fixed output voltage of 3.3V. No external components are required for this setting.

3. Quiescent Current (IQ):

   • The quiescent current is typically 40μA at an input voltage of 5V. This parameter is important for low-power applications.

4. Dropout Voltage (VD):

   • At a load current of 100mA, the dropout voltage is typically 250mV. Ensure the input voltage exceeds the output voltage by at least this amount.

5. Load Regulation:

   • The load regulation is typically 0.5% from no load to full load (0 to 300mA). This indicates how well the output voltage remains stable with varying loads.

6. Line Regulation:

   • Line regulation is typically 0.1% over the input voltage range from 2.7V to 5.5V. This shows stability in output voltage with changes in input voltage.

7. Power Supply Rejection Ratio (PSRR):

   • At a frequency of 1kHz, the PSRR is typically 65dB, indicating the device's ability to reject ripple and noise from the input supply.

8. Capacitors:

   • For optimal performance, place a 1μF ceramic capacitor close to the input pin and a 1μF ceramic capacitor on the output pin. These capacitors help stabilize the regulator and reduce output noise.

9. Thermal Considerations:

   • Ensure adequate heat dissipation if operating near maximum load conditions. The device can get warm under heavy loads, so consider thermal management techniques like heatsinking or airflow.

10. Layout:

    • Follow good PCB layout practices to minimize parasitic inductance and resistance. Keep traces short and wide where possible, especially for power and ground connections.

(For reference only)