TZMC10-GS08

TZMC10-GS08

Category: TransistorsDiodes

Specifications
SKU
7318695
Details

BUY TZMC10-GS08 https://www.utsource.net/itm/p/7318695.html
TZMC10-GS08 Zener Diodes 10V 500mW/0.5W SOD80/LL34-10V marking Low reverse current level/high stability/low noise/voltage stabilization
Parameter Description Value Unit
Device Type Description of the device type TTL to RS-485 -
Operating Voltage Supply voltage range for proper operation 3.0 to 5.5 V
Operating Current Maximum current required by the device during operation 20 mA
Data Rate Maximum data transmission rate supported 10 Mbps
Operating Temp. Temperature range in which the device can operate effectively -40 to +85 °C
Storage Temp. Temperature range for storage without damage -55 to +125 °C
Interface Type of interface provided RS-485 -
Pin Count Number of pins 8 -
Package Type Type of packaging SOP -

Instructions:

  1. Power Supply Connection: Connect the power supply within the specified operating voltage range (3.0V to 5.5V). Ensure stable power supply to avoid signal distortion or damage.

  2. Signal Wiring: Wire the RS-485 interface according to standard RS-485 guidelines. Use twisted pair cables for differential signaling to minimize noise and ensure reliable communication.

  3. Termination Resistors: For optimal performance, especially in longer cable runs, use termination resistors at both ends of the bus. The typical value is 120 ohms.

  4. Data Transmission: Set up your system to not exceed the maximum data rate of 10 Mbps. Adjust baud rates as necessary depending on the length of the RS-485 network.

  5. Environmental Conditions: Operate the device within the specified temperature ranges. Avoid exposing the device to temperatures outside these limits to prevent damage or unreliable performance.

  6. Handling Precautions: Handle with care to avoid static discharge. Use appropriate ESD protection measures when handling the component.

  7. Storage: When storing, keep the device within the storage temperature range (-55°C to +125°C) and protect from moisture and physical damage.

(For reference only)

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