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BUY SI4800BDY-T1-E3 https://www.utsource.net/itm/p/7334802.html
SI4800BDY-T1-E3 MOSFET N-Channel 30v 9A 8-SOIC marking 4800B low on-resistance/low-voltage drive
| Parameter | Description | Value |
|---|---|---|
| Part Number | Full part number of the device | SI4800BDY-T1-E3 |
| Device Type | Type of semiconductor device | MOSFET |
| Configuration | Channel configuration | N-Channel |
| Drain Source Voltage | Maximum drain-to-source voltage | 60V |
| Continuous Drain Current | Continuous drain current at specified conditions | 2.5A (at 25°C) |
| Pulse Drain Current | Peak pulse drain current | 8A |
| Gate Source Voltage | Maximum gate-to-source voltage | ±20V |
| Rds(on) | On-resistance at given Vgs and Id | 0.07Ω (at Vgs=10V, Id=2.5A) |
| Power Dissipation | Maximum power dissipation | 1.5W (at TJ = 25°C) |
| Junction Temperature | Maximum junction temperature | 150°C |
| Storage Temperature | Operating temperature range for storage | -55°C to +150°C |
| Package Type | Package type | TO-252 (DPAK) |
Instructions:
- Installation: Ensure that the device is handled with care to avoid damage to the leads or body. Use appropriate tools and techniques when soldering.
- Operating Conditions: Operate the device within the specified voltage and current limits to ensure reliable performance and prevent damage.
- Heat Management: For applications where the device will operate near its maximum power dissipation, provide adequate heat sinking to maintain junction temperatures below the maximum rated value.
- Storage and Handling: Store in a dry environment and handle with ESD precautions to prevent damage from static electricity.
- Mounting: Follow manufacturer guidelines for mounting orientation and torque specifications to ensure proper mechanical integrity.
- Testing: Before final assembly, test the device under controlled conditions to verify it meets all performance specifications.
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