XC6SLX25-3FG484C
Specifications
SKU
7402912
Details
BUY XC6SLX25-3FG484C https://www.utsource.net/itm/p/7402912.html
IC FPGA 266 I/O 484FBGA
| Parameter | Description |
|---|---|
| Device Type | Spartan-6 FPGA |
| Model | XC6SLX25-3FG484C |
| Package Type | Fine-Pitch Ball Grid Array (FBGA) |
| Pins | 484 |
| Speed Grade | -3 |
| Configuration Memory | Internal Non-Volatile Flash Memory |
| User I/Os | Up to 310 |
| Block RAM | 144 Kb |
| DSP Slices | 24 |
| Configurable Logic Blocks | 24720 |
| Operating Temperature | -40°C to +85°C |
| Supply Voltage | 1.2V core, 1.5V I/O |
| Configuration Interface | SPI, BPI, SelectMAP |
Instructions for XC6SLX25-3FG484C:
Power Supply Connections:
- Ensure that the core voltage (VCCINT) is set to 1.2V and the I/O voltage (VCCAUX) is set to 1.5V.
- Use appropriate decoupling capacitors near the power supply pins to minimize noise.
Configuration Mode Selection:
- Set the configuration mode (e.g., SPI, BPI, SelectMAP) using the M[2:0] pins before applying power.
- Refer to the Spartan-6 FPGA configuration guide for detailed pin settings.
Programming:
- Use Xilinx's iMPACT or Vivado tools to program the device.
- Ensure the correct bitstream file is generated for the XC6SLX25-3FG484C.
Clock Management:
- Utilize the on-chip DCM (Digital Clock Manager) for clock synthesis and management.
- External oscillators or PLLs can be connected to dedicated clock input pins.
Signal Integrity:
- Follow PCB layout guidelines to ensure signal integrity, especially for high-speed signals.
- Maintain proper grounding and use differential pairs for critical signals.
Thermal Management:
- Monitor the operating temperature and ensure adequate cooling if necessary.
- Place the device in areas of the PCB with good airflow.
Testing:
- After programming, perform functional testing to verify correct operation.
- Use boundary-scan (JTAG) for testing and debugging as needed.
For more detailed information, refer to the Xilinx Spartan-6 FPGA documentation and datasheets.
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