Details
BUY AZ1117CH2-3.3TRG1 https://www.utsource.net/itm/p/7495533.html
Linear Voltage Regulator IC Positive Fixed 1 Output 3.3V 800mA
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Input Voltage | VIN | Continuous | 2.5 | - | 14 | V |
| Output Voltage | VOUT | Fixed | - | 3.3 | - | V |
| Output Current | IOUT | Continuous | - | 1.0 | - | A |
| Quiescent Current | IQ | VIN=5V, VOUT=3.3V | - | 5 | - | mA |
| Dropout Voltage | VD | IOUT=500mA | - | 1.0 | - | V |
| Power Dissipation | PD | TA=25°C | - | 1.6 | - | W |
| Operating Junction Temp | TJ | Continuous | -40 | - | 125 | °C |
| Storage Temperature | TSTG | -65 | - | 150 | °C |
Instructions for AZ1117CH2-3.3TRG1
Input Voltage (VIN):
- Ensure the input voltage is within the range of 2.5V to 14V. Exceeding this range can damage the regulator.
Output Voltage (VOUT):
- The output voltage is fixed at 3.3V. No external components are required to set this voltage.
Output Current (IOUT):
- The regulator can supply up to 1.0A continuously. Ensure that the load does not exceed this current limit to avoid overheating or damage.
Quiescent Current (IQ):
- The quiescent current is approximately 5mA at an input voltage of 5V and an output voltage of 3.3V. This value helps in calculating the efficiency and power consumption.
Dropout Voltage (VD):
- At a load current of 500mA, the dropout voltage is typically around 1.0V. Keep this in mind when selecting the input voltage to ensure proper regulation.
Power Dissipation (PD):
- The maximum power dissipation at an ambient temperature of 25°C is 1.6W. Adequate heat sinking may be necessary for applications where the regulator dissipates significant power.
Operating Junction Temperature (TJ):
- The device can operate within a junction temperature range of -40°C to +125°C. Monitor the temperature to prevent thermal shutdown or damage.
Storage Temperature (TSTG):
- Store the device in environments with temperatures ranging from -65°C to +150°C to maintain its reliability.
Ensure all connections are secure and follow good engineering practices for PCB layout, especially concerning bypass capacitors and thermal considerations.
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