Details
BUY K6X1008C2D-GB70 https://www.utsource.net/itm/p/7722794.html
| Parameter | Description |
|---|---|
| Product Name | K6X1008C2D-GB70 |
| Type | DRAM |
| Capacity | 64 Mbit (8M x 8) |
| Organization | 8M x 8 |
| Voltage (Vcc) | 3.3V |
| Operating Temperature | -40°C to +85°C |
| Package Type | BGA (Ball Grid Array) |
| Pitch | 1.27 mm |
| Data Width | 8 bits |
| Access Time (tAA) | 70 ns |
| Refresh Rate | 8K refresh cycles per 64ms |
| Supply Current | 100 mA (Active), 10 mA (Standby) |
| CAS Latency | CL=2 |
| Input/Output Voltage | Vcc = 3.3V |
Instructions for Use:
- Power Supply Requirements: Ensure the power supply voltage is set to 3.3V as specified. Incorrect voltage can damage the device.
- Signal Integrity: Maintain proper signal integrity by ensuring short and matched trace lengths between the memory and controller.
- Decoupling Capacitors: Place decoupling capacitors close to the power pins of the DRAM to reduce noise and improve stability.
- Refresh Timing: Implement the required refresh rate of 8K refresh cycles per 64ms to prevent data loss.
- Operating Environment: Operate within the temperature range of -40°C to +85°C to ensure reliable performance.
- Handling Precautions: Handle with care to avoid damage to the BGA package, especially during soldering or rework processes.
- Storage Conditions: Store in a dry environment and follow anti-static precautions to prevent damage from electrostatic discharge.
For detailed application notes and further technical support, refer to the manufacturer's documentation or contact the supplier directly.
(For reference only)View more about K6X1008C2D-GB70 on main site
