Details

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BUY TC3086-QFN64-EPG https://www.utsource.net/itm/p/7959340.html

Parameter	Description	Value
Package Type	The type of packaging used for the component	QFN64 (Quad Flat No-leads)
Operating Temperature	The temperature range in which the device can operate	-40°C to +85°C
Supply Voltage Range	The voltage range within which the device operates correctly	1.7V to 3.6V
Input Voltage Range	The range of input voltages that the device can handle	VSS to VDD
Output Current Capability	Maximum current that can be supplied by the output pins	±20mA per pin
Quiescent Current	Current consumed by the device when it is not driving any load	10μA (typical)
Propagation Delay	Time delay between input transition and corresponding output transition	2ns (typical)
Storage Temperature Range	Temperature range under which the device can be stored without damage	-65°C to +150°C
ESD Rating	Electrostatic discharge tolerance	HBM: 2kV, MM: 200V
Power Dissipation	Maximum power dissipation before thermal shutdown	1.2W

Instructions for TC3086-QFN64-EPG

1. Mounting and Handling:

   • Handle with care to avoid damaging the no-leads structure.
   • Follow proper ESD precautions during handling and mounting.

2. Soldering Guidelines:

   • Use a reflow soldering process suitable for lead-free components.
   • Ensure the PCB has a thermal pad designed to accommodate the exposed pad (EPG) on the bottom of the package for optimal heat dissipation.

3. Power Supply Considerations:

   • Ensure the supply voltage remains within the specified operating range to prevent damage or erratic behavior.
   • Use appropriate decoupling capacitors close to the power pins to stabilize the power supply.

4. Operating Environment:

   • Operate the device within the specified temperature ranges to ensure reliable performance.
   • Avoid exposing the device to environments exceeding the storage temperature limits for extended periods.

5. Signal Integrity:

   • Keep signal traces as short as possible to minimize propagation delays and reflections.
   • Use ground planes to reduce noise and improve signal integrity.

6. Testing and Debugging:

   • Verify all connections and power supplies are correct before applying power.
   • Use a logic analyzer or oscilloscope to monitor signals for proper timing and levels.

Note: Always refer to the manufacturer's datasheet for detailed specifications and application notes.

(For reference only)