Details
BUY IRF5210PBF https://www.utsource.net/itm/p/8026925.html
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | V(DS) | - | - | 100 | V | |
| Gate-Source Voltage | V(GS) | -20 | 20 | V | ||
| Continuous Drain Current | I(D) | - | 37 | 48 | A | TC = 25°C |
| Pulse Drain Current | I(D) | - | 96 | - | A | t(p) = 10 μs, TC = 25°C |
| Power Dissipation | P(TOT) | - | - | 160 | W | TC = 25°C |
| Junction Temperature | T(j) | - | - | 175 | °C | |
| Storage Temperature | T(stg) | -55 | 150 | °C |
Instructions for Use:
- Handling Precautions: The IRF5210PBF is sensitive to electrostatic discharge (ESD). Handle with appropriate ESD protection measures.
- Mounting: Ensure proper heat sinking when operating at high currents or power levels to maintain junction temperature within specified limits.
- Gate Drive: Apply gate voltage within the specified range to avoid damage and ensure reliable operation. Exceeding the maximum V(GS) can cause immediate failure.
- Current Limiting: When operating in pulse mode, ensure that pulse width and frequency do not exceed safe operating area (SOA) limits.
- Thermal Management: Monitor and manage thermal conditions to prevent overheating. Use adequate heatsinking or cooling methods if necessary.
- Storage and Operation: Store and operate the device within the recommended storage and junction temperature ranges to ensure long-term reliability.
For detailed specifications and advanced applications, refer to the manufacturer's datasheet.
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