Details
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| Parameter | Description | Value | Unit |
|---|---|---|---|
| Device Type | NAND Flash Memory | ||
| Density | Storage Capacity | 16 Mbit | |
| Organization | Data Organization | x8 | |
| Vcc (Supply Voltage) | Supply Voltage | 2.7 to 3.6 | V |
| Vpp (Programming Voltage) | Programming Voltage | Not Required | |
| Ta (Ambient Temperature) | Operating Ambient Temperature Range | -40 to +85 | °C |
| tACC (Access Time) | Access Time | 70 | ns |
| Package Type | Package Style | TSOP II | |
| Pins | Number of Pins | 48 | |
| Mounting | Mounting Type | Surface Mount |
Instructions for MBM29F160TE-70PFTN
Power Supply Requirements:
- Ensure the supply voltage (Vcc) is within the specified range of 2.7V to 3.6V.
- No external programming voltage (Vpp) is required.
Temperature Considerations:
- Operate the device within the ambient temperature range of -40°C to +85°C to ensure reliable performance.
Timing Parameters:
- The access time (tACC) is 70 nanoseconds, which should be considered when designing the timing requirements of your system.
Package Handling:
- Handle the TSOP II package with care, ensuring all 48 pins are correctly aligned during surface mount assembly.
Data Organization:
- The device is organized as an x8 data bus configuration, suitable for systems requiring this interface width.
Storage and Handling:
- Store in a dry environment and handle with anti-static precautions to prevent damage to the sensitive electronic components.
Application Notes:
- Refer to the manufacturer's application notes for detailed information on initialization, command set, and error handling procedures specific to this NAND Flash memory device.
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