Details

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BUY K8D3216UBC-PI07 https://www.utsource.net/itm/p/8157777.html

Parameter	Description	Value	Unit
Product Name	K8D3216UBC-PI07
Type	DRAM
Capacity	Memory Size	32 Mbits
Organization	Data Width x Banks	16M x 4	bits
Voltage Supply	VDD, VDDQ (Power Supply)	1.5	V
Operating Temperature	Industrial Temperature Range	-40 to +85	°C
Access Time	Random Access Time	13.3	ns
Cycle Time	Minimum Cycle Time	20	ns
Refresh Rate	Refresh Period	8.192	ms
Package Type	Ball Grid Array (BGA)
Pins	Number of Balls	96
Dimensions	Package Dimensions	10 x 10 x 1.2	mm

Instructions for Use:

1. Power Supply Connection: Ensure that the VDD and VDDQ pins are connected to a stable 1.5V power supply. Proper decoupling capacitors should be placed close to the power supply pins to minimize noise.

2. Signal Integrity: To maintain signal integrity, especially at higher frequencies, ensure that all high-speed signals are properly terminated and routed with controlled impedance traces.

3. Refresh Management: Implement a refresh cycle every 8.192ms to prevent data loss. The refresh command should be issued to all banks within this period.

4. Timing Parameters: Adhere strictly to the specified access and cycle times to avoid data corruption or incorrect operations. Refer to the timing diagrams provided in the datasheet for detailed information.

5. Temperature Considerations: Operate the device within the specified temperature range (-40°C to +85°C) to ensure reliable performance and longevity.

6. Handling Precautions: This component is sensitive to electrostatic discharge (ESD). Handle with appropriate ESD protection measures such as wrist straps and conductive packaging.

7. Mounting Orientation: Ensure the correct orientation during PCB assembly to avoid damage. Verify the pin-out diagram and align the BGA balls accurately with the PCB pads.

8. Storage Conditions: Store in a dry environment to prevent moisture damage. Follow the recommended storage conditions outlined in the manufacturer's guidelines.

(For reference only)