Details

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BUY FQPF9N50CF https://www.utsource.net/itm/p/8424331.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Drain-Source Voltage	VDS			500	V	Maximum drain-to-source voltage
Gate-Source Voltage	VGS	-10		20	V	Maximum gate-to-source voltage
Continuous Drain Current	ID		9.0		A	Continuous drain current at Tc = 25°C
Pulse Drain Current	Ipp		36		A	Pulse drain current
Power Dissipation	PD			170	W	Maximum power dissipation
Junction Temperature	TJ	-55		175	°C	Operating junction temperature range
Storage Temperature	TSTG	-55		150	°C	Storage temperature range
Total Gate Charge	Qg		44		nC	Total gate charge

Instructions for FQPF9N50CF:

1. Handling Precautions:

   • Use appropriate anti-static precautions when handling the device.
   • Avoid exposing the device to excessive mechanical stress.

2. Mounting:

   • Ensure proper heat sinking if operating near maximum power dissipation.
   • Follow manufacturer guidelines for PCB layout and mounting techniques to ensure optimal performance.

3. Operating Conditions:

   • Operate within specified temperature ranges to avoid thermal damage.
   • Keep gate-source voltage within limits to prevent gate oxide breakdown.

4. Testing:

   • Perform initial testing under controlled conditions to verify correct operation.
   • Regularly inspect connections and mounting for signs of wear or damage.

5. Storage:

   • Store in a dry, cool environment away from direct sunlight.
   • Protect from moisture and contaminants that could affect performance.

6. Applications:

   • Suitable for use in switching power supplies, motor control, and other high-frequency switching applications.

(For reference only)