Details

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BUY MC74AC08D https://www.utsource.net/itm/p/8844207.html

Parameter	Symbol	Conditions	Min	Typ	Max	Unit
Supply Voltage	VCC		2.0		6.0	V
Output Low Voltage	VOL	IO = 16 mA, TA = 25°C	0.1		0.4	V
Output High Voltage	VOH	IO = -4 mA, TA = 25°C	2.4		VCC	V
Input Low Voltage	VIL	VI = 0 to VIL		0.8		V
Input High Voltage	VIH	VI = VIH to VCC		2.0		V
Propagation Delay Time	tpd	VI = VCC/2, VO = 1.5V		4.8		ns
Power Dissipation	PD	Per Package			350	mW
Operating Temperature	TJ	Junction	-40		125	°C

Instructions for MC74AC08D

1. Power Supply:

   • Ensure the supply voltage (VCC) is within the specified range of 2.0V to 6.0V.
   • Connect the ground (GND) pin to a stable 0V reference.

2. Input Signals:

   • Apply input signals ensuring they meet the required input high (VIH) and input low (VIL) voltage levels.
   • Avoid exceeding the maximum input voltage which should not be greater than VCC.

3. Output Handling:

   • When sourcing current from the output, ensure it does not exceed 16 mA to maintain the output low voltage (VOL) within specification.
   • When sinking current into the output, do not exceed -4 mA to maintain the output high voltage (VOH).

4. Propagation Delay:

   • Consider the propagation delay time (tpd) in your timing calculations, especially in high-speed applications.

5. Thermal Management:

   • Keep the junction temperature (TJ) within the operating range (-40°C to 125°C).
   • If necessary, provide adequate heat dissipation to avoid overheating.

6. Power Dissipation:

   • Monitor the power dissipation (PD) to ensure it does not exceed 350 mW per package to prevent damage or malfunction.

7. Handling Precautions:

   • Handle the device with care to avoid electrostatic discharge (ESD), which can damage sensitive components.
   • Follow proper soldering techniques and use appropriate equipment when mounting the device on a PCB.

(For reference only)