Details
BUY MC33074DR2G https://www.utsource.net/itm/p/8847313.html
| Parameter | Symbol | Conditions | Min | Typ | Max | Unit |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 4.5 | 5 | 5.5 | V | |
| Output Current (Per Channel) | IO | Continuous | - | 100 | 150 | mA |
| Peak Output Current | IOP | - | 200 | 300 | mA | |
| Operating Temperature Range | TOPR | Storage | -40 | - | 85 | °C |
| Junction Temperature | TJ | Maximum | - | - | 150 | °C |
| Power Dissipation | PD | Per Package | - | - | 625 | mW |
| Input Offset Voltage | VIO | -5 | 2 | 5 | mV | |
| Input Bias Current | IIB | - | 20 | 40 | nA | |
| Bandwidth | BW | Small Signal | - | 10 | - | MHz |
Instructions for MC33074DR2G:
Power Supply:
- Ensure the supply voltage is within the specified range of 4.5V to 5.5V to avoid damage or improper operation.
Current Handling:
- Do not exceed the maximum output current per channel (150mA continuous, 300mA peak) to prevent overheating and potential failure.
Temperature Management:
- Keep the operating temperature within -40°C to 85°C and ensure the junction temperature does not exceed 150°C.
Power Dissipation:
- Manage power dissipation carefully, ensuring it does not exceed 625mW per package to maintain reliable operation.
Signal Integrity:
- For optimal performance, keep input offset voltage within -5mV to 5mV and manage input bias currents to stay between 20nA and 40nA.
Application Considerations:
- Use appropriate heat sinking if operating near the upper limits of current and temperature.
- Ensure proper bypass capacitors are placed close to the power supply pins to stabilize the supply voltage.
For detailed specifications and advanced applications, refer to the official datasheet provided by the manufacturer.
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