Details
BUY SN74AHC04DBRE4 https://www.utsource.net/itm/p/9041816.html
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 1.8 | 5.5 | V | ||
| Output Low Voltage | VO(L) | 0.1 | V | IO = 4 mA, TA = 25°C | ||
| Output High Voltage | VO(H) | 3.5 | V | IO = -4 mA, TA = 25°C | ||
| Input Low Voltage | VI(L) | 0.8 | V | |||
| Input High Voltage | VI(H) | 2.0 | V | |||
| Propagation Delay Time | tpd | 6 | ns | VIN to VOUT, TA = 25°C | ||
| Power Dissipation | PD | 100 | mW | Per Package | ||
| Operating Temperature Range | TOPR | -40 | 85 | °C |
Instructions for SN74AHC04DBRE4
Power Supply:
- Ensure the supply voltage (VCC) is within the range of 1.8V to 5.5V.
Input Signals:
- Apply input signals with voltages that are either below 0.8V for a low logic level or above 2.0V for a high logic level.
Output Handling:
- For output loads, ensure currents do not exceed the specified limits to maintain VO(L) and VO(H) within their respective ranges.
Timing Considerations:
- Account for propagation delay times in your design, especially in timing-critical applications. The typical propagation delay time is 6ns at room temperature.
Thermal Management:
- Operate the device within the temperature range of -40°C to 85°C. For extended operation or in environments approaching these limits, consider thermal management techniques.
Power Dissipation:
- Be mindful of the power dissipation limit of 100mW per package. Design layouts to ensure adequate heat dissipation if operating near this limit.
Handling Precautions:
- Handle with care to avoid damage from electrostatic discharge (ESD). Use appropriate ESD protection measures during handling and installation.
Mounting:
- Follow standard surface mount technology (SMT) procedures for mounting. Ensure proper soldering techniques to avoid thermal stress on the component.
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