Details
BUY IRFP4332PBF https://www.utsource.net/itm/p/9228319.html
| Parameter | Symbol | Min | Typical | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | V(DS) | - | - | 55 | V | |
| Gate-Source Voltage | V(GS) | -10 | - | 20 | V | |
| Continuous Drain Current | I(D) | - | - | 30 | A | TC = 25°C |
| Pulse Drain Current | I(D pul) | - | - | 90 | A | t(p) = 10 μs, I(G) = 10 mA |
| Power Dissipation | P(TOT) | - | - | 80 | W | TC = 25°C |
| Junction Temperature | T(J) | - | - | 175 | °C | |
| Storage Temperature | T(STG) | -65 | - | 150 | °C |
Instructions for Use:
- Handling Precautions: The IRFP4332PBF is sensitive to electrostatic discharge (ESD). Handle with care and use proper ESD protection measures.
- Mounting: Ensure good thermal contact with the heat sink to maintain optimal operating temperatures. Use thermally conductive paste or a similar material between the device and the heat sink.
- Biasing: Properly bias the gate-source voltage to avoid exceeding the maximum ratings. Keep V(GS) within the specified limits to prevent damage.
- Current Limitation: Do not exceed the continuous or pulse drain current ratings. For pulse applications, ensure the duty cycle does not lead to excessive power dissipation.
- Thermal Management: Monitor the junction temperature to stay below the maximum limit of 175°C. Exceeding this can cause permanent damage.
- Storage: Store in a dry environment within the specified storage temperature range to avoid damage from moisture or extreme temperatures.
For detailed specifications and further information, refer to the manufacturer's datasheet.
(For reference only)View more about IRFP4332PBF on main site
