Details
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| Parameter | Symbol | Min | Typ | Max | Unit | Conditions |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDSS | 80 | V | |||
| Gate-Source Voltage | VGS | -15 | 15 | V | ||
| Continuous Drain Current | ID | 8 | A | TC = 25°C, Rth(j-a) = 62.5°C/W | ||
| Pulse Drain Current | Ipp | 48 | A | TC = 25°C, t = 10μs, Duty = 1% | ||
| Gate Charge | Qg | 7.5 | nC | VGS = 10V | ||
| Input Capacitance | Ciss | 1390 | pF | VDS = 15V, f = 1MHz | ||
| Output Capacitance | Coff | 300 | pF | VDS = 15V, f = 1MHz | ||
| Reverse Transfer Capacitance | Crss | 550 | pF | VDS = 15V, f = 1MHz | ||
| Threshold Voltage | VGS(th) | 1.5 | 2.5 | 4 | V | ID = 250μA, TC = 25°C |
| On-Resistance | RDS(on) | 0.12 | Ω | VGS = 10V, ID = 8A, TC = 25°C |
Instructions for Use:
Handling and Storage:
- Store in a dry environment to prevent moisture damage.
- Handle with care to avoid static damage; use anti-static packaging.
Mounting:
- Ensure proper heat sinking if operating at high currents or temperatures.
- Follow the manufacturer’s guidelines for mounting torque and thermal interface materials.
Electrical Connections:
- Connect gate and source leads carefully to minimize parasitic inductances.
- Use wide, short leads for drain connections to reduce inductance.
Operating Conditions:
- Do not exceed the maximum ratings specified in the table.
- Ensure that the gate-source voltage does not exceed ±15V to prevent gate oxide damage.
Pulse Operation:
- For pulse applications, ensure that the pulse width and duty cycle are within the specified limits to avoid overheating.
Thermal Management:
- Monitor junction temperature to stay below the maximum allowable limit.
- Consider derating continuous current as temperature increases.
Testing:
- When testing the device, use appropriate safety measures and adhere to the test conditions provided in the datasheet.
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