Details

---

BUY MDF9N60 https://www.utsource.net/itm/p/10112408.html

Parameter	Symbol	Min	Typ	Max	Unit	Description
Drain-Source Voltage	VDS	-60		60	V	Maximum drain-source voltage
Gate-Source Voltage	VGS	-20		20	V	Maximum gate-source voltage
Continuous Drain Current	ID		9		A	Continuous drain current at Tc=25°C
Pulse Drain Current	Ipp		18		A	Pulse drain current (t < 10ms)
Power Dissipation	PD			340	W	Maximum power dissipation
Junction Temperature	TJ	-55		175	°C	Operating junction temperature range
Storage Temperature	TSTG	-55		175	°C	Storage temperature range

Instructions for Use:

1. Handling Precautions:

   • Handle the MDF9N60 with care to avoid damage from electrostatic discharge (ESD). Use proper ESD protection equipment.

2. Mounting and Soldering:

   • Ensure proper heat sinking to manage thermal resistance and maintain device performance.
   • Follow recommended soldering profiles to prevent thermal damage during assembly.

3. Operating Conditions:

   • Do not exceed the maximum ratings listed in the parameter table.
   • Ensure adequate cooling if operating near maximum current or power limits.

4. Testing:

   • When testing the device, use caution with test equipment settings to avoid exceeding maximum voltages and currents.

5. Storage:

   • Store in a dry, cool environment within the specified storage temperature range to ensure long-term reliability.

6. Applications:

   • Suitable for high-frequency switching applications, motor control, power supplies, and other industrial electronics where high efficiency and reliability are required.

(For reference only)