Details
BUY SI2312BDS-T1 https://www.utsource.net/itm/p/11205620.html
| Parameter | Symbol | Min | Typ | Max | Unit | Description |
|---|---|---|---|---|---|---|
| Drain-Source Voltage | VDS | -55 | 60 | V | Maximum drain-to-source voltage | |
| Gate-Source Voltage | VGS | -12 | 12 | V | Maximum gate-to-source voltage | |
| Continuous Drain Current | ID | 3.7 | A | Continuous drain current at 25°C | ||
| Pulse Drain Current | IDP | 8.5 | A | Pulse drain current (t = 10 ms) | ||
| Power Dissipation | PD | 1.4 | W | Total power dissipation at 25°C | ||
| Junction Temperature | TJ | -40 | 150 | °C | Operating junction temperature | |
| Storage Temperature | TSTG | -55 | 150 | °C | Operating storage temperature |
Instructions for Use:
- Handling and Storage: Store the SI2312BDS-T1 in a dry, cool place. Avoid exposure to high humidity and corrosive environments.
- Mounting: Ensure proper heat sinking when mounting, especially for applications where the device may operate near its maximum power dissipation limits.
- Electrical Connections: Verify all electrical connections are secure and within specified voltage and current ratings. Pay special attention to correct polarity of VGS and VDS.
- Thermal Management: Monitor the junction temperature to ensure it remains within operational limits. Use thermal management techniques like heatsinks or forced air cooling if necessary.
- Pulse Operation: When operating in pulse mode, ensure the pulse width and frequency do not exceed the safe operating area defined by the manufacturer's datasheet.
- Testing: Before final assembly, test the device under conditions that simulate actual operating parameters to confirm performance and reliability.
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